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MHz 晶体 |
XZBBCLNANF-16.000000 |
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±20ppm |
-40°C ~ 85°C |
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表面贴装 |
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标准卷带 |
XZ |
16MHz |
±10ppm |
9pF |
200 欧姆 |
基谐 |
4-SMD，无引线 |
0.081" 长 x 0.065" 宽（2.05mm x 1.65mm） |
0.022"（0.55mm） |
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- |
符合限制有害物质指令(RoHS)规范要求 |
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MHz 晶体 |
MP184A-E |
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±50ppm |
-40°C ~ 85°C |
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通孔 |
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散装 |
MP |
18.432MHz |
±30ppm |
20pF |
25 欧姆 |
基谐 |
HC49/U |
0.427" 长 x 0.150" 宽（10.85mm x 3.80mm） |
0.530"（13.46mm） |
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符合限制有害物质指令(RoHS)规范要求 |
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XO（标准） |
KJ3270004Z |
LVCMOS |
1.8V |
±50ppm |
-20°C ~ 70°C |
0.039"（1.00mm） |
15µA |
表面贴装 |
4-SMD，无引线 |
0.098" 长 x 0.079" 宽（2.50mm x 2.00mm） |
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标准卷带 |
SaRonix-eCera™ KJ |
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符合限制有害物质指令(RoHS)规范要求 |
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XO（标准） |
FD4800046 |
CMOS |
3.3V |
±50ppm |
-20°C ~ 70°C |
0.051"（1.30mm） |
15mA |
表面贴装 |
4-SMD，无引线 |
0.197" 长 x 0.126" 宽（5.00mm x 3.20mm） |
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散装 |
SaRonix-eCera™ FD |
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符合限制有害物质指令(RoHS)规范要求 |
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XO（标准） |
PXETGLJANF-25.000000 |
启用/禁用 |
2.8 V ~ 3.3 V |
±50ppm |
-40°C ~ 85°C |
0.043"（1.10mm） |
10mA |
表面贴装 |
4-SMD，无引线 |
0.126" 长 x 0.098" 宽（3.20mm x 2.50mm） |
15µA |
剪带 |
PX |
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符合限制有害物质指令(RoHS)规范要求 |
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XO（标准） |
OCETGLJANF-26.000000 |
启用/禁用 |
3.3V |
±50ppm |
-40°C ~ 85°C |
0.059"（1.50mm） |
10mA |
表面贴装 |
4-SMD，无引线 |
0.276" 长 x 0.197" 宽（7.00mm x 5.00mm） |
10µA |
标准卷带 |
OC |
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符合限制有害物质指令(RoHS)规范要求 |
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OCXO |
NI-10M-2454 |
- |
5V |
±5ppb |
-40°C ~ 85°C |
0.500"（12.70mm） |
800mA |
通孔 |
6-DIP（1.000", 25.40mm）, 5 引线 |
1.430" 长 x 1.070" 宽（36.32mm x 27.18mm） |
- |
散装 |
NI-10M-2400 |
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符合限制有害物质指令(RoHS)规范要求 |
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XO（标准） |
KC2016B25.0000C1GE00 |
CMOS |
1.6 V ~ 3.63 V |
±50ppm |
-40°C ~ 85°C |
0.022"（0.55mm） |
5mA |
表面贴装 |
4-SMD，无引线 |
0.079" 长 x 0.063" 宽（2.00mm x 1.60mm） |
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标准卷带 |
KC2016B-C1，Kyocera |
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- |
符合限制有害物质指令(RoHS)规范要求 |
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XO（标准） |
MC2016K30.0000C16ESH |
CMOS |
1.6 V ~ 3.63 V |
- |
-40°C ~ 105°C |
0.032"（0.80mm） |
5mA |
表面贴装 |
4-SMD，无引线 |
0.079" 长 x 0.063" 宽（2.00mm x 1.60mm） |
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剪切带（CT） |
MC2016K，Kyocera |
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- |
符合限制有害物质指令(RoHS)规范要求 |
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XO（标准） |
KC2520B32K7680CM2E00 |
CMOS |
1.6 V ~ 5.5 V |
±25ppm |
-40°C ~ 85°C |
0.028"（0.70mm） |
140µA |
表面贴装 |
4-SMD，无引线 |
0.098" 长 x 0.079" 宽（2.50mm x 2.00mm） |
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标准卷带 |
KC2520B，Kyocera |
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- |
符合限制有害物质指令(RoHS)规范要求 |
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CSTCE8M00G55Z-R0 |
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表面贴装 |
表面安装 |
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±0.5% |
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- |
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±0.2% |
±0.1 %/yr |
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3 |
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3.2 x 1.3 x 0.7 mm |
0.7 mm |
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8MHz |
3.2 mm |
80 °C |
1.3 mm |
-20 °C |
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TCETBDSANF-12.8MHz |
削峰正弦波 |
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表面贴装 |
SMT |
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±2ppm |
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- |
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12.8 MHz |
±1ppm |
±1 ppm/年 |
- |
温度 |
55% |
10 |
10pF |
7 x 5 x 2mm |
2mm |
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CSTCC3M58G53-B0 |
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表面贴装 |
保护罩芯片 |
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±0.5% |
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- |
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±0.3% |
±0.3 %/yr |
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3 |
|
7.2 x 3 x 1.55 mm |
1.55 mm |
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3.58MHz |
7.2 mm |
80 °C |
3 mm |
-20 °C |
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插口，测试和预烧 |
AXS-7050-06-07 |
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- |
符合限制有害物质指令(RoHS)规范要求 |
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晶体，振荡器 |
6 |
7.00mm x 5.00mm x 1.40mm |
11 周 |
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NBXDBA019LNHTAG |
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CLCC |
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±50ppm |
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- |
- |
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6 |
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7 x 5 x 1.9mm |
1.9mm |
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- |
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7mm |
85 °C |
5mm |
-40 °C |
250MHz |
3.3 V |
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- |
- |
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DSC1001CI2-024.5760 |
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CDFN |
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±25ppm |
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- |
- |
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4 |
|
3.2 x 2.5 x 0.85mm |
0.85mm |
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- |
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3.2mm |
85 °C |
2.5mm |
-40 °C |
24.576MHz |
3.6 V |
1.7 V |
AEC-Q100 |
- |
- |
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DSC1124DI1-100.0000 |
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VDFN |
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±50ppm |
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- |
- |
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6 |
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2.5 x 2 x 0.85mm |
0.85mm |
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- |
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2.5mm |
85 °C |
2mm |
-40 °C |
100MHz |
3.6 V |
2.25 V |
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- |
- |
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表面贴装 |
QC7A16.3840F12B12R |
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表面贴装 |
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±10ppm |
45Ω |
SMD |
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±20ppm |
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4 |
12pF |
7 x 5 x 1mm |
1mm |
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7mm |
85°C |
5mm |
-40°C |
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XO（标准） |
XUP536156.250JS6I |
启用/禁用 |
3.3V |
±25ppm |
-40°C ~ 85°C |
0.047"（1.20mm） |
115mA |
表面贴装 |
6-SMD，无引线 |
0.197" 长 x 0.126" 宽（5.00mm x 3.20mm） |
- |
剪带 |
XUP |
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- |
符合限制有害物质指令(RoHS)规范要求 |
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